产品介绍：
Technical Notes:
1.A new, non-fluorinated, copper CVD precursor exhibiting a higher sublimation rate and lower de composition rate than
2.Copper CVD precursor used in the deposition of copper films with low carbon content
References:
1.J.Mater. Res.. 1998. 13, 687
2.Surface and Coating Technology, 2002, 150, 205.
