产品介绍：
产品说明
应用
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
包装
1 ea in rigid mailer
基本信息
| 经验(实验)分子式 | Ni |
| 分子量 | 58.69 |
| EC 号 | 231-111-4 |
| MDL编号 | MFCD00011137 |
| PubChem化学物质编号 | 329767317 |
| NACRES | NA.23 |
产品性质
| 质量水平 | 100 |
| 测定 | 99.95% trace metals basis |
| 形式 | solid |
| reaction suitability | core: nickel |
| 电阻率 | 6.97 μΩ-cm, 20℃ |
| 直径× 厚度 | 2.00 in. × 0.25 in. |
| bp | 2732 ℃ (lit.) |
| mp | 1453 ℃ (lit.) |
| 密度 | 8.9 g/mL at 25 ℃ (lit.) |
| SMILES string | [Ni] |
| InChI | 1S/Ni |
| InChI key | PXHVJJICTQNCMI-UHFFFAOYSA-N |
安全信息
| 象形图 |   |
| 警示用语： | Danger |
| 危险声明 | H317 - H351 - H372 |
| 预防措施声明 | P202 - P260 - P264 - P280 - P302 + P352 - P308 + P313 |
| 危险分类 | Carc. 2 - Skin Sens. 1 - STOT RE 1 |
| 储存分类代码 | 6.1D - Non-combustible, acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects |
| WGK | WGK 2 |
| 闪点(F) | Not applicable |
| 闪点(C) | Not applicable |
