2,4-Dimethoxy-5-pyrimidylboronic Acid (contains varying amounts of Anhydride)

2,4-二甲氧基-5-嘧啶硼酸 (含不同量的酸酐)

2-(3-溴苯基)-4,4,5,5-四甲基-1,3,2-二氧杂环戊硼烷, 2-(3-Bromophenyl)-4,4,5,5-tetramethyl-1,3,2-dioxaborolane

弯抱霉菌素, (S)-Curvularin

Diaion WA30 游离碱, Diaion WA30 free base

DEAE-Sephadex A-25, chloride form

甲氧基甲基三苯基膦溴化物, Methoxymethyltriphenylphosphine bromide

咪唑氢溴酸盐, Imidazole hydrobromide

丙胺氢溴酸盐, Propylamine Hydrobromide

Neodymium(III) nitrate hydrate

硝酸钕(III)水合物

Thulium(III) oxide

氧化铥(III)