产品介绍:
应用
Step soldering involving temperature sensitive components, Soldering to molded interconnect device (MID) plastics, Fusible alloys/fuse applications, Mercury replacement, Thermal and electrical conductivity.
备注
Keep container tightly sealed. Store in cool, dry conditions in well sealed containers.
基本信息
MDL
MFCD00144387
EINECS
231-163-8
分子式
Ga:In; 40:60 wt%
灵敏度
Ambient temperatures.
形态
Solid
溶解性
Insoluble in water.
安全信息
TSCA
是